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Board mounting technology Product List

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Regarding the component land method in circuit board design and assembly.

Regarding the component land method in circuit board design and assembly.

A method that directly contacts the pins to the legs and electrodes of the measuring components!

This document provides information on the component land method. It introduces a method of making contact at numbered positions using diagrams and conducting individual measurements. Detailed diagrams are included, making it a useful reference. We encourage you to read it. [Contents (excerpt)] ■ Board mounting, quality, technology ■ About the component land method *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board
  • Board mounting technology

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Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

★New manufacturing methods (tandemization of multiple wavelengths, MCM, organic LEDs) ★Topics on phosphors (such as sialon phosphors) and key points of phosphor coating technology.

Speaker Mr. Gen Murakami, Ph.D. in Engineering, Representative Director of Genten Co., Ltd. Target Audience: Engineers, researchers, and relevant departments facing challenges with LED packages Venue: Tekno Kawasaki, 5th Floor, Room 5 [Kanagawa, Kawasaki] 10-minute walk from JR Nambu Line "Musashi-Mizonokuchi" Station Date and Time: March 29, 2011 (Tuesday) 12:30-16:30 Capacity: 30 people *Registration will close once full. Please apply early.

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Board mounting technology

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Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

Design, structure, assembly technology of LED packages, and implementation technology onto substrates.

★Trend of Transparent Resin: Resin with Fluorescent Materials! Low Stress Resinization! High Refractive Index!

**Lecture Summary** Semiconductor packaging technology is an important technology that enhances the functionality of electronic devices, alongside semiconductor miniaturization technology and logic design technology. It continues to lead the world in semiconductor packaging materials and assembly equipment. In recent years, the technology has evolved from SiP (System in Package) using multi-layer stacking of elements to MiP (Multi functions in a Package), which integrates not only electronic conduction but also wireless (RF) and optical (photon) functions within a single package. As LED assembly technology becomes a crucial technology for the MiP era, this presentation will provide an overview of the current LED assembly technology and discuss future development directions and impacts on the market.

  • Technical Seminar
  • LED Module
  • LED lighting
  • Board mounting technology

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Design, structure, assembly technology of LED packages, and implementation technology on substrates.

Design, structure, assembly technology of LED packages, and implementation technology on substrates.

Trends in transparent resin: resin with phosphors! Low-stress resin! High refractive index! New manufacturing methods (multi-wavelength tandem, MCM, organic LED).

Speaker: Mr. Gen Murakami, President of Mototen Co., Ltd., Doctor of Engineering Venue: Tekno Kawasaki, 5th Floor, Room 5 Date and Time: March 29, 2011 (Tuesday) 12:30-16:30

  • Company：AndTech
  • Price：10,000 yen-100,000 yen
  • Technical Seminar
  • Board mounting technology

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